Canteliver Probe Card
MPI Cantilever Probe Card is widely utilized on gold bump and pad wafer tests for Show driver, logic, and memory product. MPI’s cantilever probes are classified as the corresponding answer for the calls for of fine pitch, smaller pad size, large pace, less cleaning, multi-DUT, substantial pin depend, and extremely-small leakage specifications. With exceptional craftsmanship, ground breaking architecture and confirmed methodologies depending on mechanical and electrical simulation/measurement benefits, building MPI the highest cantilever company all over the world.
FCB Probe Card
The FCB Probe Card is easily the most experienced technological know-how of buckling beam probe card. It is actually aimed to obtain the semiconductor ship manufacture time-to-market (TTM) and price of exam (COT) demand from customers. FCB is often a demonstrated Option for various semiconductor creation exams from early engineering pilot-runs to superior volume producing (HVM). FCB is prepared for unit requiring superior sign integrity probing (SI) and/or electricity integrity probing (PI). Programs consist of chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus much more. FCB ensures the planet’s most effective Over-all Expense-of-ownership (COO) for several DUT programs.
EVS Probe Card
The EVS Probe Card is definitely an improvement in excess of the conventional buckling beam probe card. Critical functions are higher latest carrying capability (C.C.C.) and lessen balanced Call power (BCF), in addition to Over-all MEMS-like qualities. EVS can certainly meet the prerequisite of Sophisticated wafer probing. Specific alignment and superb planarity Regulate will be the critical elements contributing to steady contact resistance. With its ability and general performance, EVS Probe Card is an excellent option for Sophisticated probe cards.
Osprey probe card
The Osprey probe card is MPI’s Alternative to demand for ever finer pitch. It truly is suitable for smaller sized Al pad, and is also perfect for very small pitch application with peripheral and total array pattern. With exact alignment and improved planarity Manage, Osprey can achieve better efficiency by multi-DUT design. The forming wire (FW) kind needle developed with MPI’s individual micro fabrication system not only delivers higher-good quality effectiveness but will also allows simple needle substitute and shortens preserving cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle that's made for the need of minimal power probing. In addition, it comes with the ability to satisfy high C.C.C. and high pin counts software. The MEMS system makes sure remarkably regular needle attributes, along with the Particular structure design permits exact alignment and planarity Manage.
MPI probe card Canteliver Probe Card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/